簡(jiǎn)稱(chēng)<?XML:NAMESPACE PREFIX = O />

英文全稱(chēng)

中文解釋

SMT

Surface Mounted Technology

表面貼裝技術(shù)

SMD

Surface Mount Device

表面安裝設(shè)備(元件)

DIP

Dual In-line Package

雙列直插封裝

QFP

Quad Flat Package

四邊引出扁平封裝

PQFP

Plastic Quad Flat Package

塑料四邊引出扁平封裝

SQFP

Shorten Quad Flat Package

縮小型細(xì)引腳間距QFP

BGA

Ball Grid Array Package

球柵陣列封裝

PGA

Pin Grid Array Package

針柵陣列封裝

CPGA

Ceramic Pin Grid Array

陶瓷針柵陣列矩陣

PLCC

Plastic Leaded Chip Carrier

塑料有引線(xiàn)芯片載體

CLCC

Ceramic Leaded Chip Carrier

塑料無(wú)引線(xiàn)芯片載體

SOP

Small Outline Package

小尺寸封裝

TSOP

Thin Small Outline Package

薄小外形封裝

SOT

Small Outline Transistor

小外形晶體管

SOJ

Small Outline J-lead Package

J形引線(xiàn)小外形封裝

SOIC

Small Outline Integrated Circuit Package

小外形集成電路封裝

MCM

Multil Chip Carrier

多芯片組件

MELF

圓柱型無(wú)腳元件

D

Diode

二極管

R

Resistor

電阻

SOC

System On Chip

系統(tǒng)級(jí)芯片

CSP

Chip Size Package

芯片尺寸封裝

COB

Chip On Board

板上芯片